The product is widely used in high-growth fields such as artificial intelligence, new energy vehicles, and high-speed network communication.
Mass production capability of 28-layer HDIs with an 8+12+8 build-up and R&D validation of 30-layer HDIs with a 10+10+10 build-up, empowering cutting edge AI acceleration cards
Mass production capability of 70+ layer
MLPCBs and technical capability for 100+
layer MLPCBs, enabling next-generation AI servers
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